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Impact of paperboard deformation and damage mechanisms on packaging performance

19 July 2023
4:00 pm
On-line seminar

5° Seminar:

Research and innovation on materials & mechanics for paper, paperboard and paper products:

a series of seminars from worldwide experts


With material properties as a starting point, this presentation focuses on analyzing the performance of a paperboard package. Instead of focusing on simulating a specific load case as accurately as possible, the approach uses a basic material model based on measurable input parameters and FEM for varying design, geometry, and load case. The presentation explicitly addresses how moisture, creases, and bending stiffness affect packaging performance.


Join at:

Gustav Marin, Research Institutes of Sweden - Stockholm, Sweden