Research Collaborator

Techniques to reduce the computational complexity in heat conduction and thermo-mechanics

Position opening 17 DICEMBRE 2015, 18:04:

Type of contract

1 posizione Research Collaborator

Research areas

Unità di Ricerca

MUSAM

Fields:

Thermo-mechanics, Fracture mechanics, Computational methods, Model order reduction techniques

Activity:

Development of model order reduction techniques to simplify the complexity of heat conduction and thermo-mechanical simulations of photovoltaic modules; development of numerical methods for the solution of partial differential equations in thermo-mechanical problems involving laminates.

Formal requirements:

Possession of a 4 or 5-years undergraduate degree or equivalent MSc’s level education in Engineering, Physics or related areas. Experience in the development of techniques to reduce the computational complexity of mathematical models in numerical simulations, model order reduction techniques, with applications to heat conduction, thermo-mechanics, and modelling of thermo-visco-elastic materials are requested skills. The candidate must have a curriculum with a suitable scientific and professional background for carrying out research activity in the required field. Excellent knowledge of English, both written and spoken.

Specific requirements:

Articles published in scientific journals, in conference proceedings, and doctoral experience confirming the requested skills

Project:

“CA2PVM - Multi-field and multi-scale Computational Approach to design and durability of PhotoVoltaic Modules” financed in the framework of FP7 ERC Starting grant

Scientific area:

Ingegneria Civile e Architettura, Settore Scientifico Disciplinare ICAR/08 Scienza delle Costruzioni

Gross amount:

€ 25.000,00/ a year

Duration:

1 year renewable based on funding availability, and up to the end of the project “CA2PVM - Multi-field and multi-scale Computational Approach to design and durability of PhotoVoltaic Modules”

Selection procedure

Application

Apply ONLINE only.
Before starting prepare the application attachments and information as listed below.